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High Precision Etched Lead Frames ±0.01mm Tolerance Custom Sizes

High Precision Etched Lead Frames ±0.01mm Tolerance Custom Sizes

ブランド名: XHS/Customize
モデル番号: Customize
MOQ: 10
価格: 50-100USD
支払条件: T/T
供給能力: 10000-100000PCD / week
詳細情報
Place of Origin:
China
証明:
ISO 9001, ISO 14001, IATF 16949
Materials:
Stainless steel, Titanium or customized
Thickness:
0.01mm-3.0mm
Tolerance:
+/- 0.01mm
Size:
Customized
Advantages:
Cost-effective, High Quality
Process Type:
Chemical etching
Durability:
Corrosion resistant, wear resistant
Packaging Details:
PE bags and Carton
Supply Ability:
10000-100000PCD / week
ハイライト:

high precision etched lead frames

,

custom stainless steel photo etching

,

lead frames with ±0.01mm tolerance

製品説明

High Precision Etched Lead Frames Manufacturer ±0.03mm Tolerance ISO Certified


Your Trusted Lead Frame Manufacturing Partner

Xinhsen Tech specializes in high-precision etched lead frames for semiconductor packaging, offering superior alternatives to traditional stamped frames. With ±0.01mm tolerance and 0.02-3.0mm thickness range, our photo chemically etched lead frames deliver unmatched precision for QFN, DFN, QFP, and other advanced IC packages.

 

Why Choose Our Etched Lead Frames?

Unmatched Precision

Fine-pitch capability down to 0.015mm line width

Multi-tier designs with consistent accuracy (±0.01mm)

Burr-free edges for perfect die attachment


Material Expertise

Copper alloys (C194, C7025) - Optimal conductivity

Kovar/Alloy 42 - Low CTE for sensitive applications

Custom silver/gold plating available

 

Advanced Manufacturing

Photo chemical etching for complex geometries

Monthly capacity: 1,000,000+ units

5-7 day prototyping for fast NPI

 

Reliability Assurance

100% automated optical inspection

JEDEC-compliant production standards

Material certifications (SGS, RoHS)

 

Key Specifications

Thickness  0.02-3.0mm
Tolerance ±0.01mm
Min. Pitch 0.1mm
Surface Finish Matte, polished, plated
Lead Count

 Up to 500 I/Os

 

Applications

Power ICs - Superior heat dissipation

LED Packaging - Precise light alignment

MEMS Devices - Ultra-fine features

Automotive Electronics - Vibration-resistant

5G/Wireless ICs - High-frequency performance

 

Competitive Advantages

30% Cost Savings vs. stamped alternatives

Faster Tooling - No hard tooling required

Design Flexibility - Modify frames without tooling changes

Just-in-Time Delivery - Reliable supply chain

High Precision Etched Lead Frames ±0.01mm Tolerance Custom Sizes 0